This report studies the Die Bonder market, covering market size for segment by type (Fully Automatic Equipment, Semi-Automatic Equipment, etc.), by application (Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Test (OSAT), etc.), by Sales Channel (Direct Channel, Distribution Channel), by player (Besi, ASM Pacific Technology, Kulicke & Soffa, Palomar Technologies, Shinkawa, etc.) and by region (North America, Europe, Asia-Pacific, South America and Middle East & Africa).

This report provides detailed historical analysis of global market for Die Bonder from 2015-2020, and provides extensive market forecasts from 2021-2030 by region/country and subsectors. It covers the sales/revenue/value, gross margin, historical growth and future perspectives in the Die Bonder market.

Moreover, the impact of COVID-19 is also concerned. Since outbreak in December 2019, the COVID-19 virus has spread to all around the world and caused huge losses of lives and economy, and the global manufacturing, tourism and financial markets have been hit hard, while the online market/industry increase. Fortunately, with the development of vaccine and other effort by global governments and organizations, the negative impact of COVID-19 is expected to subside and the global economy is expected to recover.

This research covers COVID-19 impacts on the upstream, midstream and downstream industries. Moreover, this research provides an in-depth market evaluation by highlighting information on various aspects covering market dynamics like drivers, barriers, opportunities, threats, and industry news & trends. In the end, this report also provides in-depth analysis and professional advices on how to face the post COIVD-19 period.

The research methodology used to estimate and forecast this market begins by capturing the revenues of the key players and their shares in the market. Various secondary sources such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data, have been used to identify and collect information useful for this extensive commercial study of the market. Calculations based on this led to the overall market size. After arriving at the overall market size, the total market has been split into several segments and subsegments, which have then been verified through primary research by conducting extensive interviews with industry experts such as CEOs, VPs, directors, and executives. The data triangulation and market breakdown procedures have been employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments.

Leading players of Die Bonder including:
Besi
ASM Pacific Technology
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
Fasford Technology
West-Bond
Hybond

Market split by Type, can be divided into:
Fully Automatic Equipment
Semi-Automatic Equipment
Manual Equipment

Market split by Application, can be divided into:
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

Market split by Sales Channel, can be divided into:
Direct Channel
Distribution Channel

Market segment by Region/Country including:
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Spain etc.)
Asia-Pacific (China, Japan, Korea, India, Australia and Southeast Asia etc.)
South America (Brazil, Argentina and Colombia etc.)
Middle East & Africa (South Africa, UAE and Saudi Arabia etc.)

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Table of Contents

Chapter 1 Die Bonder Market Overview
1.1 Die Bonder Definition
1.2 Global Die Bonder Market Size Status and Outlook (2015-2030)
1.3 Global Die Bonder Market Size Comparison by Region (2015-2030)
1.4 Global Die Bonder Market Size Comparison by Type (2015-2030)
1.5 Global Die Bonder Market Size Comparison by Application (2015-2030)
1.6 Global Die Bonder Market Size Comparison by Sales Channel (2015-2030)
1.7 Die Bonder Market Dynamics (COVID-19 Impacts)
1.7.1 Market Drivers/Opportunities
1.7.2 Market Challenges/Risks
1.7.3 Market News (Mergers/Acquisitions/Expansion)
1.7.4 COVID-19 Impacts on Current Market
1.7.5 Post-Strategies of COVID-19 Outbreak
Chapter 2 Die Bonder Market Segment Analysis by Player
2.1 Global Die Bonder Sales and Market Share by Player (2018-2020)
2.2 Global Die Bonder Revenue and Market Share by Player (2018-2020)
2.3 Global Die Bonder Average Price by Player (2018-2020)
2.4 Players Competition Situation & Trends
2.5 Conclusion of Segment by Player
Chapter 3 Die Bonder Market Segment Analysis by Type
3.1 Global Die Bonder Market by Type
3.1.1 Fully Automatic Equipment
3.1.2 Semi-Automatic Equipment
3.1.3 Manual Equipment
3.2 Global Die Bonder Sales and Market Share by Type (2015-2020)
3.3 Global Die Bonder Revenue and Market Share by Type (2015-2020)
3.4 Global Die Bonder Average Price by Type (2015-2020)
3.5 Leading Players of Die Bonder by Type in 2020
3.6 Conclusion of Segment by Type
Chapter 4 Die Bonder Market Segment Analysis by Application
4.1 Global Die Bonder Market by Application
4.1.1 Integrated Device Manufacturers (IDMs)
4.1.2 Outsourced Semiconductor Assembly and Test (OSAT)
4.2 Global Die Bonder Revenue and Market Share by Application (2015-2020)
4.3 Leading Consumers of Die Bonder by Application in 2020
4.4 Conclusion of Segment by Application
Chapter 5 Die Bonder Market Segment Analysis by Sales Channel
5.1 Global Die Bonder Market by Sales Channel
5.1.1 Direct Channel
5.1.2 Distribution Channel
5.2 Global Die Bonder Revenue and Market Share by Sales Channel (2015-2020)
5.3 Leading Distributors/Dealers of Die Bonder by Sales Channel in 2020
5.4 Conclusion of Segment by Sales Channel
Chapter 6 Die Bonder Market Segment Analysis by Region
6.1 Global Die Bonder Market Size and CAGR by Region (2015-2030)
6.2 Global Die Bonder Sales and Market Share by Region (2015-2020)
6.3 Global Die Bonder Revenue and Market Share by Region (2015-2020)
6.4 North America
6.4.1 North America Market by Country
6.4.2 North America Die Bonder Market Share by Type
6.4.3 North America Die Bonder Market Share by Application
6.4.4 United States
6.4.5 Canada
6.4.6 Mexico
6.5 Europe
6.5.1 Europe Market by Country
6.5.2 Europe Die Bonder Market Share by Type
6.5.3 Europe Die Bonder Market Share by Application
6.5.4 Germany
6.5.5 UK
6.5.6 France
6.5.7 Italy
6.5.8 Russia
6.5.9 Spain
6.6 Asia-Pacific
6.6.1 Asia-Pacific Market by Country
6.6.2 Asia-Pacific Die Bonder Market Share by Type
6.6.3 Asia-Pacific Die Bonder Market Share by Application
6.6.4 China
6.6.5 Japan
6.6.6 Korea
6.6.7 India
6.6.8 Southeast Asia
6.6.9 Australia
6.7 South America
6.7.1 South America Market by Country
6.7.2 South America Die Bonder Market Share by Type
6.7.3 South America Die Bonder Market Share by Application
6.7.4 Brazil
6.7.5 Argentina
6.7.6 Colombia
6.8 Middle East & Africa
6.8.1 Middle East & Africa Market by Country
6.8.2 Middle East & Africa Die Bonder Market Share by Type
6.8.3 Middle East & Africa Die Bonder Market Share by Application
6.8.4 UAE
6.8.5 Saudi Arabia
6.8.6 South Africa
6.9 Conclusion of Segment by Region
Chapter 7 Profile of Leading Die Bonder Players
7.1 Besi
7.1.1 Company Snapshot
7.1.2 Product/Service Offered
7.1.3 Business Performance (Sales, Price, Revenue, Gross Margin and Market Share)
7.1.4 COVID-19 Impact on Besi
7.2 ASM Pacific Technology
7.3 Kulicke & Soffa
7.4 Palomar Technologies
7.5 Shinkawa
7.6 DIAS Automation
7.7 Toray Engineering
7.8 Panasonic
7.9 Fasford Technology
7.10 West-Bond
7.11 Hybond
Chapter 8 Upstream and Downstream Analysis of Die Bonder
8.1 Industrial Chain of Die Bonder
8.2 Upstream of Die Bonder
8.2.1 Raw Materials
8.2.2 Labor Cost
8.2.3 Manufacturing Expenses
8.2.4 Manufacturing Cost Structure
8.2.5 Manufacturing Process
8.3 Downstream of Die Bonder
8.3.1 Leading Distributors/Dealers of Die Bonder
8.3.2 Leading Consumers of Die Bonder
Chapter 9 Development Trend of Die Bonder (2021-2030)
9.1 Global Die Bonder Market Size (Sales and Revenue) Forecast (2021-2030)
9.2 Global Die Bonder Market Size and CAGR Forecast by Region (2021-2030)
9.3 Global Die Bonder Market Size and CAGR Forecast by Type (2021-2030)
9.4 Global Die Bonder Market Size and CAGR Forecast by Application (2021-2030)
9.5 Global Die Bonder Market Size and CAGR Forecast by Sales Channel (2021-2030)
Chapter 10 Appendix
10.1 Research Methodology
10.2 Data Sources
10.3 Disclaimer
10.4 Analysts Certification